3D Printing Resin
At iMakr we offer a range of proven and tested SLA/DLP 3D printer resins to suit a variety of needs. For jewellers, we have castable resins from top suppliers that produce high quality samples ready for casting. For engineers, we offer durable and hard wearing resins ideal for spare parts and prototypes. We also stock specialty materials such as flexible or high resolution resins.
EnvisionTEC | E-Model
EnvisionTEC | ABS Tough
The ABS Tough Resin is a tough ABS-like 3D printing material.
EnvisionTEC | E-Glass 2.0
EnvisionTEC E-Glass 2.0 is a clear material with excellent surface quality.
EnvisionTEC | E-Guide
The EnvisionTEC E-Guide Resin is a biocompatible Class I material. It was developed for the production of high precision surgical drill guides that are used for implant surgery.
EnvisionTEC | E-Orthoshape
The EnvisionTEC E-Orthoshape is an ABS-like resin used for the production of orthodontic models.
EnvisionTEC | E-Model
E-Model resin is a good choice for a wide range of modeling needs, including high-precision dental and orthodontic 3D models. It is ideal for producing high-quality prototypes as well as end-use parts.
Choose EnvisionTEC | E-Model Light for your cDLM or E1.
Choose EnvisionTEC | E-Model Light U for your Ultra or Perfactory.
These are equivalents of the current E-Model Light DLP and E-Model Beige / E-Model U references from Desktop Health, the new name for EnvisionTEC.
Validity: October 2023
EnvisionTEC | E-Rigid PU
The EnvisionTEC E-Rigid PU Resin is polyurethane-like and is great for printing for end-use and prototype parts.
EnvisionTEC | E-RigidForm
The EnvisionTEC E-RigidForm produces hard, stiff parts, so it is mostly used to print for prototypes and end use.
EnvisionTEC | ABS Flex
The EnvisionTEC Resin ABS Flex is an extremely flexible material and can be used for an array of manufacturing processes, including snap-fit items and more.
LOCTITE 3D | 5015 Silicone
The Henkel LOCTITE® 3D 5015 silicone is very unique which means that it bonds to itself, eliminating any of the "layer to layer" interface problems during the light cure application.